Apple S M1 Ultra Uses Tsmc S Info Li Packaging Method Enabling Lower Cost In Mass Producing The Custom Soc
There Were Several Ways to Use a Bridge to Allow Two M1 Max Chipsets to Communicate With One Another, but TSMC’s InFO_LI Enables Cost Reduction TSMC’s CoWoS-S packaging method is used by many of the chip maker’s partners, including Apple, so it was assumed that the M1 Ultra would also be mass produced using it. However, Tom’s Hardware reported that Tom Wassick, a semiconductor packaging engineering professional, republished a slide clarifying the packaging method, showing that Apple employed the use of InFO_LI on this occasion....